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| Hardware
Design |
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Steps leading to hardware design:
- We analyze the customer's hardware
requirement with respect to costing,
space constraints, availability
of components including lead time
and typical component failure rate.
- We also ask for a list of common
inventory parts with the customer
so that we may utilize the same
within our design, if possible.
- Next we undertake hardware design
using ORCAD or similar Schematic
Design Tool. The schematic is drawn
up based on the specifications provided.
- Next a prototype of the hardware
is built using standard general
purpose boards. For more complex
designs, a special PCB is designed
and built primarily for prototype
purposes.
- In all cases, continuous customer
interaction is involved so that
the product developed meets specifications
and requirements.
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| Software
Development |
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Steps leading to software development.
- We analyze the customer's software
features and the operational logic
provided. We recommend that a flowchart
be generated by the customer so
that the operational logic is clarified.
However, if the flowchart is not
provided, we generate a flowchart
which is given to the customer to
verify. Most of the time, this is
done in a joint meeting with the
customer and our team of engineers.
- Based on the flowchart the preliminary
software is generated. Care is taken
to implement all cross functional
modules to prevent software bugs.
- Next, interface drivers to hardware
modules are written and tested with
the prototype hardware.
- Finally the software drivers
are integrated with the main loop
and tested for functionality.
- The software is implemented at
the client site and monitored closely
by our engineering team responsible
for the development. In some cases,
the final debug is carried out at
the client site.
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| Analog
and Digital Simulation |
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The first version of the project software
is verified with simulators to fine
tune the logic and the timing. Analog
simulation is done where the project
requires analog signal inputs. Similarly,
for projects requiring digital inputs,
we generate the signals using either
standard equipment like frequency generators
or build special jigs that generate
signals that are close to the type of
input required. Most analog simulation
includes hardware prototypes.
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| Printed
Circuit Board Layout |
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We design most of our boards using ORCAD,
P-CAD or CADSTAR. We have designed up
to 12 layer PCBs for both SMT, PTH or
hybrid assembly. Our experience in PCB
design is over 17 years. Our boards
are designed taking various factors
like EMI, RFI interference both with
regard to emission and radiation effects.
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| Complete
design documentation. |
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Documentation is the most important
part for successful project implementation.
We provide complete details with comprehensive
documentation related to both the hardware
and software.
Our typical transfer of technology documentation
consist of the following:
- Schematic diagram
- Bill of materials [BOM]
- Vendor listing related to BOM.
- PCB layout design.
- PCB artwork design Gerber outputs
[Softcopy or Films].
- PCB silkscreen design.
- Mechanical dimension drawings.
- Source Code listing for software
with annotations.
- Code documentation with flowcharts.
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| Packaging
and Prototypes. |
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With our vast experience and network
of engineering consultants, we can provide
packaging solutions in plastic and metal
for products. Our product engineering
group also provide engineered prototypes
for field trials and marketing trials.
Do write to us for more details since
this is on a case to case basis.
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| Our
capability for coding is both in Assembly
and C |
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Coding in Assembly Language
We provide coding services using Assembly
language for the target processor. Comprehensive
documentation for this is provided along
with flowcharts as described above.
Coding in C Language
We also provide coding services using
'C' language both using HI-TECH-C for
the PICmicro and other C compilers for
the target procesor. Again, comprehensive
documentation is provided along with
flowcharts.
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| Design
Consultation. |
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In addition to our design services,
in case you wish to develop the product
yourself, we provide you with consultation
on design and development. This is usually
on a as-required basis. Please let us
know what you need. Our services are
comprehensive and we can provide you
with any kind of help with design using
PIC. We have a comprehensive facility
with all the necessary tools to help
you design your product in our facility.
A comfortable and secure environment
allows you to complete your project
fast and get it into production with
our guidance, if required.
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| Wafer
DIE bonding |
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We offer services in packaging of ICs
for high volume requirements. With our
die bonding facility, diced silicon
dies can be bonded on a substrate as
per your requirement. Please contact
us if you need more information on this
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| SMT
manufacturing facility |
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We provide surface mount manufacturing
for volume requirements in manufacturing.
Our assembly facility is comprehensive
with pick and place machines, automated
screen printing machines, automated
wave soldering machines, In Circuit
Test machines and a completely air-conditioned
and Antistatic facility offering comprehensive
manufacturing for both mid and large
volume requirements.
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| PTH
manufacturing facility |
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Our manufacturing facility includes
PTH assembly, both manual [for low volume,
high mix products] and for large volume
products. A separate PTH manufacturing
facility is also available for prototype
quick turn manufacturing and concept
evaluation manufacturing requirements
as well as quick turn pilot run projects.
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| In
Circuit Testing [ICT] and Burn-In |
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Our ICT facility consists of both
Genrad and HP equipment. We will need
either your Bed-of-Nails fixture or
CAD information to manufacture the
same [Manufacturing of Bed of Nails
fixture will be charged extra]. ICT
will provide you with results of each
board enabling you to power up and
complete functional testing as well
as troubleshooting information related
to missing parts, reversed parts,
bad parts and solder defects related
to the error information. ICT allows
speedy and volume manufacturing of
PCB and provides instantaneous feedback
to the line regarding manufacturing
defects so that it may be controlled
during the process flow.
We provide Burn-In facility for assembled
PCBs to sort out infant mortality
of the product. The Burn-In chambers
are temperature controlled and provide
temperature cycling through a range
of presettable temperatures. In addition,
humidity control is also available
for more critical and destructive
testing for assemblies.Traceable test
facilities.
Our test facilities provide traceability
reports related to each product or
unit manufactured. These reports are
useful for military grade assemblies
as well as for prototypes that will
go in for type approval. |
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| We
also undertake testing for UL and CSA
and other standards for product performance
approvals. |
